Shenzhen, China- Honor Device Co. Ltd., an AI device ecosystem company and BYD Auto Co. Ltd., have formed a strategic partnership to integrate HONOR’s vehicle connectivity with BYD’s next-gen DiLink ecosystem, aiming to deliver human-centric, AI-powered mobility. The deal, signed by leaders from both companies, focuses on three pillars: core tech (cross-device integration, AI agent integration, high-precision Bluetooth car key), channel ecosystem and user benefits, and joint communications and launches.
Building on collaborations since 2023 (NFC car keys, 2024 in-vehicle fast charging), the 2025 phase sees DENZA as the first to adopt HONOR Car Connect, with expansion across more BYD brands. Results of the partnership will be showcased at HONOR’s Global Developers Conference and AI Device Ecosystem Conference on October 23, highlighting the HONOR AI Connect platform.
Mr. James Li, CEO of HONOR, said, “At HONOR, we have always believed that the key to maximizing human potential lies in the combination of a human-centric focus and technology. Our partnership with BYD is a comprehensive collaboration for the AI era, with smart mobility as the key strategic focus at this stage. Together, we will advance joint technology development, complement each other’s strengths, and co-create an ecosystem of seamless and intelligent mobility experiences that enrich every journey and help usher in a new paradigm of smart living.”
Mr. CP Khandelwal, CEO, PSAV Global (Official Partner for HONOR Smartphones), said, “This collaboration with BYD represents a step toward a truly intelligent mobility ecosystem. Through integrating HONOR’s connectivity solutions with BYD’s intelligent ecosystem, we are co-creating seamless, intelligent experiences that elevate every journey. This collaboration reflects our shared vision of creating an interconnected, AI-driven world where devices, vehicles, and lifestyles work in harmony. It also showcase show innovation and collaboration are shaping the future of mobility in the AI era."