Toshiba Launches TLX9161T Photorelay for EV Systems

Düsseldorf, Germany- Toshiba Electronics Europe GmbH., an electronic component business, has introduced the TLX9161T, a new automotive photorelay designed to meet the growing high-voltage demands of modern automotive systems. Housed in a compact SO12L-T package, the device delivers an output withstand voltage (VOFF) of 1500V (min.) with a fast reaction time of 1ms (max.), making it ideally suited for battery management systems (BMS), fuel-cell control, and high-voltage monitoring applications. It also provides a solid-state alternative to traditional mechanical relays.

The TLX9161T integrates an infrared (IR) LED optically coupled to a photo-MOSFET, ensuring complete electrical isolation between the control side and the switching side. With an isolation voltage of 5000Vrms, it provides safe switching across varying potentials. The device achieves low energy consumption with a trigger current (IFT) of just 3mA (max.), while the off-state current (IOFF) is limited to 100nA (max.) at ambient temperature. Both the forward current for the IR LED and the on-state current of the MOSFET are rated at 30mA.

Compared to its predecessor, the TLX9160T, the new device features a reduced MOSFET chip size, allowing Toshiba to house it in the SO12L-T package, which is approximately 25% smaller than the SO16L-T package. Despite its compact form factor, the TLX9161T maintains the same pin pitch and layout, enabling drop-in compatibility with existing board designs. The package measures 7.76mm × 10.0mm × 2.45mm, helping reduce overall battery unit size and cost.

Engineered for safety and compliance, the TLX9161T uses a resin material with a Comparative Tracking Index (CTI) above 600, classifying it under IEC60664-1 Material Group I. It provides creepage and clearance distances of 8mm (min.), ensuring reliable isolation across a wide operating temperature range of -40°C to +125°C. Fully compliant with AEC-Q101 Grade 1, the device delivers the performance, safety, and durability demanded by next-generation automotive applications.

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