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RRP Electronics MoU with AMB, Taiwan, on memory modules, targeting $25M in revenue, using its Mahape OSAT facility and expanding to Taloja.
Date: November 18, 2024
Mumbai- RRP Electronics Limited, a semiconductor company, has signed a Memorandum of Understanding (MoU) with AMB, Taiwan to collaborate on complete Technology agreement for Memory modules - SPI NAND, MICROSD, EMMC, and SSD and production to the tune of $ 25 million to start with initially.
With extended capacities from 2GB onwards, the technology covers complete package structure details, substrate designs, test program development and supporting tool design.
Mr. Rajendra Chodankar, Chairman of RRP Electronics Limited said, “RRP Electronics is excited to partner with AMB, Taiwan. This association which will be deployed immediately at our OSAT facility will have these parts being supplied to Samsung and many leading giant corporates. The OSAT facility by virtue of this association promises a $ 25 million revenue per annum in the coming times.”
The company’s 40,000 sq.ft. state of the art OSAT facility at Mahape is operational since September 2024. Besides, the company is going to add more production lines at its new plant at MIDC, Taloja, which is expected to be operational within the next two years.
OSAT technology is crucial for the semiconductor industry, focusing on the final stages of chip production. After semiconductor wafers are manufactured, OSAT providers handle the assembly, packaging, and testing of these chips. The assembly process involves attaching the semiconductor chip to a substrate and applying protective packaging to ensure its integrity and performance. Various packaging solutions are used depending on the chip’s application requirements. This phase is essential for preparing the chip for integration into electronic devices.
Testing is another critical component of OSAT services, involving rigorous checks to ensure each semiconductor device meets performance and quality standards. This includes electrical, thermal, and mechanical testing to verify functionality and durability. As the semiconductor industry evolves, OSAT technology continues to advance, incorporating innovative materials and techniques like 3D packaging and high-density interconnects. This ongoing innovation is driven by increasing demands for miniaturization and higher performance, making OSAT a key enabler of technological progress in electronics.
About RRP Electronic Limited:
RRP Electronics leads in semiconductor innovation, specializing in testing, design, and fabrication for automotive, telecom, and imaging. Its incubation hub fosters collaboration, driving technological progress with expert-led solutions.
