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December 18, 2024
Valeo and ROHM Semiconductor collaborate to develop and optimize next-gen power modules for electric motor inverters, leveraging their expertise in power electronics.
Date: December 6, 2024Paris, France - Valeo SA., an automotive technology company, and ROHM Co., Ltd., a semiconductor manufacturer, has collaborated to develop and optimize next-generation power modules for electric motor inverters. As the first step in this collaboration, ROHM will supply its 2-in-1 Silicon Carbide (SiC) molded module, the TRCDRIVE pack, to Valeo for future powertrain solutions.
Valeo is expanding access to efficient, electrified mobility across all vehicle types, from e-bikes to e-trucks. By combining its expertise in mechatronics, thermal management, and software with ROHM’s power modules, Valeo advances power electronics solutions, enhancing performance, efficiency, and decarbonization in automotive systems globally.
Valeo and ROHM have been collaborating since 2022 to enhance the performance and efficiency of motor inverters in electric and plug-in hybrid vehicles. Their focus on refining power electronics aims to optimize cost/performance by improving energy efficiency, reducing heat through optimized cooling and mechatronic integration, and boosting reliability with SiC packaging.
Mr. Xavier DUPONT, Valeo Power Division CEO, said, "This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics. Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility."
Mr. Wolfram HARNACK, President ROHM Semiconductor GmbH, said, "We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo."